Home > Copper Clad Laminates > Rogers RT/duroid 5880LZ DK2.00 PTFE Laminates 0.25mm - 1.27mm High Frequency Low Loss PCB Material

Rogers RT/duroid 5880LZ Laminate
Material:Rogers RT/duroid 5880LZ / Filled PTFE with ED Copper
MOQ:1 Sheet
Price:199-799 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:7-12 working days
Payment Method:T/T, Paypal
 

Rogers RT/duroid 5880LZ DK2.00 PTFE Laminates 0.25mm - 1.27mm High Frequency Low Loss PCB Material


Brief Introduction

RT/duroid 5880LZ is a filled PTFE composite laminate engineered for demanding stripline and microstrip circuit applications in high-frequency electronics. It provides a low-density, lightweight solution suitable for performance-critical and weight-sensitive designs, such as aerospace and advanced communication systems.


Technical Features & Benefits

Low and Stable Dielectric Constant: The dielectric constant (εr) remains consistently low at 2.00 across panels and over a wide frequency range, ensuring reliable signal integrity in RF and microwave circuits.
Low Dissipation Factor: With a typical loss tangent of 0.0021, the material supports low-loss performance up to Ku-band and beyond, ideal for high-frequency printed circuit boards.
Excellent Thermal and Dimensional Stability: Low thermal coefficient of εr (+20 ppm/°C) and minimal dimensional change (-0.38%) ensure reliable operation under varying environmental conditions.
Superior Electrical Properties: High volume and surface resistivity, along with strong dielectric strength (40 kV), provide robust insulation and performance in multilayer PCB designs.


Rogers RT/duroid 5880LZ Laminate


Typical Properties: RT/duroid 5880LZ

Property Typical Value [1] Direction Units Condition Test Method
Dielectric Constant, εr (Process)2.00 ± 0.04Z 10 GHz / 23°CIPC-TM-650, 2.5.5.5
Dielectric Constant, εr (Design)2.00Z 8 GHz - 40 GHzDifferential Phase Length
Dissipation Factor, tan δTyp: 0.0021 Max: 0.0027Z 10 GHz / 23°CIPC-TM-650, 2.5.5.5
Thermal Coefficient of εr+20Zppm/°C-50°C to 150°C, 10 GHzIPC-TM-650, 2.5.5.5
Volume Resistivity1.74 × 10⁷ MΩ·cmC-96/35/90IPC-TM-650, 2.5.17.1
Surface Resistivity2.08 × 10⁶ C-96/35/90IPC-TM-650, 2.5.17.1
Electrical Strength40 kVD48/50IPC-TM-650, 2.5.6
Dimensional Stability-0.38X,Y% IPC-TM-650, 2.4.39A
Moisture Absorption0.31 %24 hr / 23°CIPC-TM-650, 2.6.2.1
Thermal Conductivity0.33ZW/m·K80°CASTM C518
Coefficient of Thermal Expansion54, 47 (X,Y) 40 (Z)X,Y / Zppm/°C0 to 150°CIPC-TM-650, 2.4.41
Outgassing - TML0.01 % ASTM E-595
Outgassing - CVCM0.01 % ASTM E-595
Outgassing - WVR0.01 % ASTM E-595
Density1.4 g/cm³ ASTM D792
Copper Peel Strength>4.0 pli IPC-TM-650, 2.4.8
Flammability RatingV-0   UL 94
Lead-Free Process CompatibleYES    

Available Configurations

Standard Thicknesses Standard Panel Sizes Standard Claddings
0.010" ±0.0007" (0.25mm)12" × 18" (305 × 457 mm)½ oz ED Copper (HH/HH)
0.020" ±0.0015" (0.51mm)24" × 18" (610 × 457 mm)1 oz ED Copper (H1/H1)
0.050" ±0.0015" (1.27mm)Additional sizes availableOther cladding weights available

 

Get a Quick Quote

Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for Rogers RT/duroid 5880LZ Laminate.

No file chosen

Max 10MB/file: .zip, .pdf, .jpg, .png, .txt (multiple)

Your information is safe. We'll respond within 24 hours.


Next Wangling F4BM217 DK2.17 PTFE Laminates 0.1mm - 12.0mm RF Microwave PCB Material